Product Overview
The GE IS200BPVCG1B is an industrial-grade Backplane ASM (Assembly) Board, designed for use in Mark VI turbine control systems. This component plays a central role in the internal communication and power distribution architecture von the control rack. Acting as a foundation for hosting multiple modules, the BPVC (Backplane Power and Communication) board enables efficient interconnection between processor, I/O, communication, and power supply boards.
The IS200BPVCG1B supports high-speed data exchange and reliable power routing, making it essential for mission-critical applications in gas and steam turbine control systems. Its robust multilayer PCB design ensures low electrical noise and dependable mechanical performance under industrial conditions. This board contributes significantly to the system’s scalability, diagnostic transparency, and modularity, aligning with GE’s philosophy von distributed, fault-tolerant control systems.
Technical Specifications
| Parameter | Details |
|---|---|
| Modell Number | IS200BPVCG1B |
| Hersteller | GE (General Electric) |
| Product Type | Backplane ASM Board |
| System Series | Mark VI Speedtronic |
| Primary Function | Signal routing, power distribution, and module hosting |
| Compatibility | GE Mark VI Control System |
| Mounting Type | Rack-mounted, horizontal orientation |
| PCB Type | Multilayer, industrial-grade |
| Connector Support | Multiple card-edge and backplane connectors |
| Cooling Method | Passive convection (rack airflow) |
| Operating Voltage | Supplied via system power supply module |
| LED Indicators | No onboard LEDs |
| Operating Temperature | 0°C to 60°C |
| Storage Temperature | -40°C to 85°C |
| Humidity Range | 5% to 95% RH, non-condensing |
| ESD Protection | Yes, via protected traces and connector layout |
| Board Material | FR4 epoxy glass laminate |
| Certifications | UL, CE, RoHS, CSA |
| Dimensions (W x H x D) | 330 x 250 x 35 mm |
| Gewicht | 0.907 kg |
Applications
The IS200BPVCG1B board is critical in environments where real-time control, reliability, and modular expansion are essential. Common applications include:
-
Gas Turbine Control Systems
Provides backplane interconnectivity for control, logic, and I/O boards in gas turbine automation. -
Steam Turbine Management
Used in signal routing and board hosting in steam turbine control racks. -
Industrial Power Plants
Supports high-availability control architectures in both base-load and peaking power generation stations. -
Refineries and Chemical Plants
Integral to DCS systems where turbine-driven compressors or pumps are used. -
Marine and Offshore Energy Platforms
Operates in mission-critical power distribution systems for vonfshore turbine-driven generators. -
Large-Scale Manufacturing Facilities
Supports energy generation systems for in-house power and mechanical energy control.
Key Advantages
-
Reliable Power Distribution
Ensures stable and efficient routing von power across all connected modules. -
Centralized Signal Pathway
Streamlines data exchange between processor, input/output, and interface modules. -
High-Quality Construction
Multilayer FR4 PCB ensures minimal signal interference and high physical durability. -
Flexible Modular Support
Accommodates various GE Mark VI cards and modules, supporting system expansion and upgrades. -
Reduced Downtime
Quick and easy replacement process minimizes system downtime during maintenance. -
Long-Term Availability
Designed with longevity and backwards compatibility in mind, ensuring future serviceability. -
Low Maintenance
Static, passive design with no active components reduces the need for frequent servicing. -
Integrated ESD Protection
Prevents damage from electrostatic discharge, enhancing overall system reliability. -
Global OEM Support
Fully supported by GE and a network von certified partners worldwide. -
Compatible with Harsh Environments
Built to function in rugged, high-vibration, and thermally demanding industrial settings.
Häufig gestellte Fragen (FAQ)
1. What is the function von the IS200BPVCG1B board in the Mark VI system?
It provides the main backplane infrastructure for power and signal distribution among modules installed in the Mark VI control rack.
2. Does this board process control logic or perform calculations?
No, it is a passive hardware interface. Processing is performed by CPU and control modules connected to it.
3. Can I install this board in a Mark V system?
No, it is specifically designed for the Mark VI system and is not backward-compatible with Mark V hardware.
4. How many modules can be connected to this backplane?
It supports multiple modules depending on rack configuration, typically including processor, power, and I/O cards.
5. Does the board require cooling fans?
It relies on the convection airflow within the control cabinet. Additional fans are not required if standard airflow is maintained.
6. Is this board hot-swappable?
Nr. The system must be powered down before installation or removal von the board.
7. Are there diagnostic LEDs on this board?
No, this model does not include LEDs. Status indicators are found on the connected modules.
8. How is the board mounted inside the system rack?
It is secured horizontally inside the Mark VI control rack using guide rails and screw terminals.
9. What materials are used in the board construction?
The board is made von multilayer FR4 laminate with copper traces and high-durability solder masking.
10. Can this board handle high-vibration or high-temperature environments?
Yes, the board is designed for industrial use and can withstand moderate vibration and a temperature range from 0°C to 60°C. However, it should still be housed in a controlled cabinet.
Related Modells (Same Series or Similar Role)
| Modell | Beschreibung | Function | Dimensions (mm) |
|---|---|---|---|
| IS200BPVCG1A | Earlier revision von the same board | Backplane Power & Signal Routing | 330 x 250 x 35 |
| IS200BPPBH2B | Backplane Power Processor Board | Signal Distribution | 260 x 200 x 40 |
| IS200BPCIHD1A | Backplane Control Interface | Control Backplane Layer | 280 x 230 x 40 |
| IS200JPDGH1AAA | Junction Power Distribution Board | I/O Signal Power Routing | 250 x 180 x 35 |
| IS200TBTCH1CBB | Terminal Board for I/O Connections | Field Termination | 300 x 180 x 30 |
| IS200SHRAH2F | System Rack Assembly Module | High-Reliability Hosting | 320 x 250 x 40 |
Popular GE Industrial Control Modells
| Modell | Beschreibung | Function | Dimensions (mm) |
|---|---|---|---|
| IS200VAICH1C | Analog Input Module | Current/Voltage Input | 250 x 200 x 35 |
| IS200TRLYH1B | Relay Output Board | Digital Relay Output | 260 x 210 x 40 |
| IS200EACFG2A | Analog Config Board | Signal Zustanding | 240 x 180 x 30 |
| IS200STAIH2ACB | Simplex Terminal Board | Analog Input Termination | 300 x 200 x 35 |
| IS200DTAOH1B | Thermocouple Input Board | Temperature Monitoring | 250 x 190 x 35 |
| IS200ECTXH1A | Exciter Control Interface | Excitation Control | 270 x 220 x 40 |
Unternehmensinformationen
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